HiperTFS

Description
The HiperTFS™ device family members incorporate both a high-power two-switch-forward converter and a mid-power flyback (standby) converter into a single, low-profile eSIP™ power package. The single chip solution provides the controllers for the two-switch-forward and flyback converters, high- and low-side drivers, all three of the high-voltage power MOSFETs, and eliminates the converter's need for costly external pulse transformers. The device is ideal for high power applications that require both a main power converter (two-switch forward) up to 414 W, and standby converter (flyback) up to 20 W. HiperTFS includes Power Integrations' standard set of comprehensive protection features, such as integrated soft-start, fault and over-load protection, and hysteretic thermal shutdown. HiperTFS utilizes advanced power packaging technology that simplifies the complexity of two-switch forward layout, mounting and thermal management, while providing very high power capabilities in a single compact package. The devices operate over a wide input voltage range, and can be used following a power-factor correction stage such as HiperPFS.
Product Highlights
Key Benefits
- Single chip solution for two-switch forward main and flyback standby
- High integration allows smaller form factor and higher power density designs
- Incorporates control, gate drive, and three HV power MOSFETs
- Level shift technology eliminates need for pulse transformer
- Protection features include: UV, OV, OTP, OCP, & SCP
- Transformer reset control
- Prevents transformer saturation under all conditions
- Allows >50% duty cycle operation
- Reduces primary side RMS currents & conduction losses
- Standby supply provides built-in overload power compensation
- Up to 434 W total output power in a highly compact package
- Up to 550 W peak
- High efficiency solution easily enables design to meet stringent efficiency specifications.
- >90% efficiency at full load
- No-load regulation and low losses at light-load
- Simple clip mounting to heat sink without need for insulation pad
- Halogen free and RoHS compliant
Applications
- PC
- Printer
- LCD TV
- Video game consoles
- High power adaptors
- Industrial & appliance
| Output Power Table1 | ||||||
|---|---|---|---|---|---|---|
| PRODUCT2 | Two-Switched Forward 380 V | Flyback 100 V - 400 V | ||||
| Cont. (25 °C) | Cont. (50 °C) | Peak (50 °C) | 50 °C | |||
| TFS757HG | 193 W | 163 W | 228 W | 20 W | ||
| TFS758HG | 236 W | 200 W | 278 W | 20 W | ||
| TFS759HG | 280 W | 235 W | 309 W | 20 W | ||
| TFS760HG | 305 W | 258 W | 358 W | 20 W | ||
| TFS761HG | 326 W | 276 W | 383 W | 20 W | ||
| TFS762HG | 360 W | 304 W | 407 W | 20 W | ||
| TFS763HG | 388 W | 327 W | 455 W | 20 W | ||
| TFS764HG | 414 W | 344 W | 530 W | 20 W | ||
Notes:
- Maximum practical continuous power in an open frame design with adequate heat sinking (assuming heat sink ΘC-A of <4 °C/W), measured at specified ambient temperature (see Key Applications Considerations for more information).
- Package: H: eSIP16/12. (Note: Direct attach to heat sink, does not require insulation SIL pad)
| Product Documents | |
|---|---|
| Application Note | |
| Package Information | |
| Data Sheet | |
| Reference Designs* | |
|---|---|
| RDK-249 | Reference Design Report for 14.5 W Standby and 300 W Main Power Supply Using HiperTFS™ TFS762HG |
*DAKs/RDKs include a working power supply, sample devices, unpopulated pcb, data sheet, comprehensive engineering report, PI Expert design software and other related documentation.







